TY - CONF T1 - Thermal stability of self-assembled monolayer copper preservatives for fluxless soldering JO - ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings PY - 2006/01/01 AU - Ebbens SJ AU - Hutt DA AU - Liu CQ ED - SP - 1360 EP - 1366 Y2 - 2025/05/25 ER -