TY - CONF T1 - Thermal cycling reliability of polycrystalline diamond and aluminium nitride substrates JO - 2014 International Symposium on Power Electronics, Electrical Drives, Automation and Motion PY - 2014/01/01 AU - Balakrishnan M AU - Sweet MR AU - Narayanan EMS ED - DO - DOI: 10.1109/speedam.2014.6872061 PB - IEEE Y2 - 2025/06/29 ER -